Blar i SINTEF Open på forfatter "Tollefsen, Torleif Andre"

Viser treff 1-3 av 3

    • Electronic packaging for harsh environments 

      Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif (Lecture, 2016)

    • High Temperature Power Electronics Packaging 

      Larsson, Andreas; Tollefsen, Torleif Andre; Storstrøm, Olav Barros; Fallet, Truls (SINTEF Rapport;, Research report, 2013)
      The lack of robust and reliable packaging methods are considered to be one of the main challenges for the next generation of high temperature electronics (>200 °C). Power electronics are especially difficult to operate in ...

    • A Review of Eutectic Au-Ge Solder Joints 

      Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)
      Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ...